| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To enable the actions of driving IC chips to be stabilized, the manufacturing process to be made simpler and the manufacturing cost to be saved by more reliably reducing excessive voltage fluctuations and thereby restraining the occurrence of radiation noise. <P>SOLUTION: There is provided a bypass capacitor 17 formed by successively stacking dielectrics 15 and conductors 16 over a terminal electrode 10 positioned near the mounting position of a driving IC chip 11 in a terminal part 2a of an electrode substrate 2 and between the driving IC chip 11 and external wiring 9. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
