Electronic component and method for manufacturing said electronic component

摘要

The component (2) has an electronic chip (6) arranged on an upper face (10) of a substrate (4) and/or inside the substrate. A thick layer (8) is made of electrically insulating material, and covers the face and/or part of the chip. A cavity (30) is formed inside the layer. The cavity is partly filled with a heat-absorbing material (42) having specific heat capacity greater than 1 kilojoules per kilogram per Kelvin at temperature of 25 degree Celsius and at pressure of 100 kPa. A bottom of the cavity and/or a side wall of the cavity are covered with a thermal interface layer (40). The thick layer is made of polymer. An independent claim is also included for a method for manufacturing an electronic component.