| 摘要 |
<p>The present invention relates to an ultrasonic scrubber having a heat blocking function, and more particularly to an ultrasonic scrubber having a heat blocking function, which is provided at a predetermined place including a pipe to transfer waste gas of semiconductor fabrication facilities and a high-temperature heat treatment chamber to transfer ultrasonic vibration, thereby preventing dust from being suck. The present invention provides an ultrasonic scrubber including: a scrubber chamber placed on an exhaust gas of was gas emitted from a semiconductor process chamber; an ultrasonic wave transfer band closely fixed to an outer circumference of the scrubber chamber while surrounding the outer circumference of the scrubber; a heat blocking vibration member fixedly attached to the ultrasonic wave transfer band; an ultrasonic transducer coupled to an opposite end of the heat blocking vibration member to provide ultrasonic vibration; and an ultrasonic transducer drive power amplifier for electrically driving the ultrasonic transducer. The heat can be prevented from transferred to the ultrasonic transducer, the loss of the ultrasonic vibration energy can be minimized, and the efficiency and the stability of the ultrasonic transducer under a high-temperature environment can be ensured.</p> |
