EPOXY RESIN COMPOSITE AND PRINTED CIRCUIT BOARD COMPRISING ISOLATION USING THE SAME

摘要

An epoxy resin composition according to an embodiment of the present invention comprises: an epoxy compound of Chemical Formula; at least two kinds of hardening agents; and an inorganic filler. One of the hardening agents is 4, 4′-diaminodiphenylsulfon. Herein, R1 to R6 can be respectively selected from the group consisting of H, Cl, Br, F, C1-C3 alkyl, C1-C3 alken, and C1-C3 alkyn; and n is 1, 2, or 3.