发明名称 GROUNDING INSTRUMENT, STRUCTURE, AND GROUNDING METHOD OF CONDUCTOR HAVING INSULATION LAYER ON SURFACE
摘要 PROBLEM TO BE SOLVED: To perform grounding of an object having an insulation layer such as a coating or insulated plating on the surface.SOLUTION: When a grounding instrument 1 is adsorbed to grounding target 8 by a magnetic force, projections 2 penetrate through an insulation layer 10 and are electrically connected to a conductor 9. Since the projections 2 are electrically connected to a conducting wire 4 and the conducting wire 4 is connected to the ground 7, grounding work is completed only by making the grounding instrument 1 adsorbed to the grounding target 8.
申请公布号 JP2014107092(A) 申请公布日期 2014.06.09
申请号 JP20120258593 申请日期 2012.11.27
申请人 NEC COMPUTERTECHNO LTD 发明人 SASAKI YUTA
分类号 H01R4/64;H01T19/04;H02G1/02;H05F3/02 主分类号 H01R4/64
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