发明名称 |
GROUNDING INSTRUMENT, STRUCTURE, AND GROUNDING METHOD OF CONDUCTOR HAVING INSULATION LAYER ON SURFACE |
摘要 |
PROBLEM TO BE SOLVED: To perform grounding of an object having an insulation layer such as a coating or insulated plating on the surface.SOLUTION: When a grounding instrument 1 is adsorbed to grounding target 8 by a magnetic force, projections 2 penetrate through an insulation layer 10 and are electrically connected to a conductor 9. Since the projections 2 are electrically connected to a conducting wire 4 and the conducting wire 4 is connected to the ground 7, grounding work is completed only by making the grounding instrument 1 adsorbed to the grounding target 8. |
申请公布号 |
JP2014107092(A) |
申请公布日期 |
2014.06.09 |
申请号 |
JP20120258593 |
申请日期 |
2012.11.27 |
申请人 |
NEC COMPUTERTECHNO LTD |
发明人 |
SASAKI YUTA |
分类号 |
H01R4/64;H01T19/04;H02G1/02;H05F3/02 |
主分类号 |
H01R4/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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