| 摘要 |
Disclosed is a photosensitive resin composition for a resist material, which contains (A) 30-70% by mass of an alkali-soluble polymer, (B) 20-60% by mass of a compound that has an ethylenically unsaturated double bond, and (C) 0.1-20% by mass of a photopolymerization initiator. The photosensitive resin composition contains, as (B) the compound that has an ethylenically unsaturated double bond, (B-1) a compound that has at least a hydroxyl group, a phenyl group and two or more ethylenically unsaturated double bonds in each molecule, and (B-2) a compound that has an ethylene oxide group and a (meth)acryloyl group in each molecule. |
