发明名称 ANALYTICAL METHOD OF ALDEHYDE COMPOUNDS IN METAL PLATING SOLUTION
摘要 <p>PROBLEM TO BE SOLVED: To provide an analytical method of aldehyde compounds in a metal plating solution which can detect aldehyde compounds in a metal plating solution to a level of below 0.1 mg/mL with a simple and economical method.SOLUTION: An analytical method of aldehyde compounds in a metal plating solution includes the steps of: preparing a supersaturate aldehyde derivative solution by dissolving the aldehyde derivative to be supersaturated while adding a pH regulation solution in the aldehyde derivative to control to substantially same pH as pH of the metal plating solution; adding the supersaturated aldehyde derivative solution in the metal plating solution, derivatizing aldehyde compounds existing in the metal plating solution, and obtaining aldehyde derivative compounds; extracting the aldehyde derivative compounds; and analyzing the aldehyde compounds from the extracted aldehyde derivative compounds.</p>
申请公布号 JP2014106226(A) 申请公布日期 2014.06.09
申请号 JP20130086159 申请日期 2013.04.16
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 JEON JI EUN;LEE SE KYUNG;YOON HYO JIN;HAM SUK JIN
分类号 G01N30/06;G01N27/62;G01N30/72;G01N30/88;G01N31/00;G01N33/20 主分类号 G01N30/06
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