发明名称 |
ANALYTICAL METHOD OF ALDEHYDE COMPOUNDS IN METAL PLATING SOLUTION |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide an analytical method of aldehyde compounds in a metal plating solution which can detect aldehyde compounds in a metal plating solution to a level of below 0.1 mg/mL with a simple and economical method.SOLUTION: An analytical method of aldehyde compounds in a metal plating solution includes the steps of: preparing a supersaturate aldehyde derivative solution by dissolving the aldehyde derivative to be supersaturated while adding a pH regulation solution in the aldehyde derivative to control to substantially same pH as pH of the metal plating solution; adding the supersaturated aldehyde derivative solution in the metal plating solution, derivatizing aldehyde compounds existing in the metal plating solution, and obtaining aldehyde derivative compounds; extracting the aldehyde derivative compounds; and analyzing the aldehyde compounds from the extracted aldehyde derivative compounds.</p> |
申请公布号 |
JP2014106226(A) |
申请公布日期 |
2014.06.09 |
申请号 |
JP20130086159 |
申请日期 |
2013.04.16 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
JEON JI EUN;LEE SE KYUNG;YOON HYO JIN;HAM SUK JIN |
分类号 |
G01N30/06;G01N27/62;G01N30/72;G01N30/88;G01N31/00;G01N33/20 |
主分类号 |
G01N30/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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