RF MODULE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an RF (radio frequency) module and a method of manufacturing the same.SOLUTION: The RF module includes: an RF IC device which also functions as a main substrate and in which a via is formed for connecting the upper and lower surfaces thereof with each other; an electronic component which is mounted on the upper surface or the lower surface of the RF IC device; a molding material having the electronic component sealed therein to protect the electronic component and formed on the upper surface or the lower surface of the RF IC device; and an auxiliary substrate coupled with the upper surface or the lower surface of the RF IC device and providing a place at which other electronic components than the electronic component sealed in the molding material are mounted. The auxiliary substrate is provided with a through hole having a predetermined size to mount the other electronic components therein. Thus, the RF IC device is capable of designing an IC circuit of a WLCSP and designing an I/O pitch with a sufficient degree of freedom by allowing the RF IC device to perform a function of a main circuit substrate and introducing an auxiliary substrate to secure flexibility of I/O implementation.