TOUCH MEMBER AND METHOD OF MANUFACTURING THE SAME

摘要

A wiring board includes a substrate, a first conductor layer, a second conductor layer, and a through-via conductor. The substrate has a first surface, a second surface, and at least one through-via. The first conductor layer is formed on the first surface, and the second conductor layer is formed on the second surface. The through-via conductor is formed in the through-via for electrically connecting to the first conductor layer and the second conductor layer. The through-via has a first depressed portion exposed in the first surface, a second depressed portion exposed in the second surface, and a tunnel portion between the first depressed portion and the second depressed portion for connecting the first depressed portion and the second depressed portion. The first depressed portion and the second depressed, portion are non-coaxial.

主权项

1. A wiring board comprising:
a substrate having a first surface and a second surface, the substrate having at least one through-via passing through the substrate from the first surface to the second surface; a first conductor layer formed on the first surface; a second conductor layer formed on the second surface; and a through-via conductor formed in the through-via for electrically connecting to the first conductor layer and the second conductor layer; wherein the through-via has a first depressed portion exposed in the first surface, a second depressed portion exposed in the second surface, and a tunnel portion between the first depressed portion and the second depressed portion for connecting the first depressed portion and the second depressed portion, wherein the first depressed portion and the second depressed portion are non-coaxial, and an internal diameter of the tunnel portion is less than a diameter of the first depressed portion in the first surface and a diameter of the second depressed portion in the second surface.