PEELING DEVICE, PROCESSING DEVICE, PEELING METHOD, AND PROCESSING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a peeling device capable of efficiently removing an adhesive which entered around an outer periphery of a semiconductor wafer.SOLUTION: A peeling device 100 comprises a remover infiltration unit 110, a support glass peeling unit 120, and an adhesive peeling unit 130. The remover infiltration unit 110 infiltrates a remover 150 which weakens adhesive strength of an adhesive 230 to a semiconductor wafer 210 into the adhesive 230 in a semiconductor wafer laminate 200. The support glass peeling unit 120 peels a support glass 220 from the semiconductor wafer laminate 200 processed by the remover infiltration unit 110. The adhesive peeling unit 130 peels the adhesive 230 from the semiconductor wafer laminate 200 from which the support glass 220 was peeled by the support glass peeling unit 120.