发明名称 HEATING BODY COOLING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a heating body cooling structure which enables easy design and manufacturing of heat radiation fins without needing accurate dimensional control of the heat radiation fins.SOLUTION: A heating body cooling structure of the invention includes: a heating body; and a heat radiation device which is disposed so as to enable heat conduction with the heating body. The heat radiation device includes: a heat sink 22 which is disposed so as to enable heat conduction with the heating body; multiple heat radiation fins 23 which protrude from the heat sink 22 and are provided so as to extend in a predetermined direction along a surface of the heat sink; and a facing surface 32 which is disposed at a position separated from tips 23a of the multiple heat radiation fins 23 and faces the heat sink 22. A refrigerant 24 flows between the heat radiation fins 23 and the facing surface 32 in an arrangement direction a perpendicular to an extension direction of the heat radiation fins 23.
申请公布号 JP2014103241(A) 申请公布日期 2014.06.05
申请号 JP20120254135 申请日期 2012.11.20
申请人 NISSAN MOTOR CO LTD 发明人 SEKINE KANEKATSU
分类号 H01L23/473;H01L23/36;H05K7/20 主分类号 H01L23/473
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