| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique for facilitating the handling of a resin molding possessing a wafer.SOLUTION: The provided method for manufacturing a resin molding 50 includes (a) a step of preparing a wafer 51, (b) a step of forming, on the wafer 51 by baring the front surface 51a thereof, a resin molding portion 52 covering the rear surface 51b and outer peripheral surfaces 51c thereof, and (c) a step of irradiating a laser beam 23L onto the border of the wafer 51 and resin molding portion 52 from the front surface 51a side so as to remove the resin molding portion 52 on the peripheries of the wafer 51 in a state where a residual resin molding portion 52 having a plane view contour conforming to the wafer 51 remains on the rear surface 51b of the wafer 51. |
