LAYER STRUCTURE COMPRISING COPPER LAYER, INDIUM-SILVER ALLOY LAYER AND ITS OXIDE LAYER ON IRON-CONTAINING SUBSTRATE, AND LAYER STRUCTURE COMPRISING COPPER LAYER, ALLOY LAYER OF INDIUM, SILVER AND AT LEAST ONE METAL SELECTED FROM GROUP CONSISTING OF Se, Sb, Co AND Ni ON IRON-CONTAINING SUBSTRATE, AND METHOD FOR PRODUCING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a layer structure having thin plating thickness, hardly peeling off, having excellent wire bonding properties and sulfur resistance, without suffering from reflectance deterioration, that enables life prolongation, reducing a cost and improving a quality.SOLUTION: A layer structure comprising a copper layer, an indium-silver alloy layer containing 40 mass% to 90 mass% of indium and further comprising a layer of oxide of the indium-silver alloy on the indium-silver alloy layer in that order on an iron-containing substrate in which copper diffuses in the alloy layer; or a layer structure comprising a copper layer, a layer of alloy of indium, silver and at least one metal selected from a group consisting of Se, Sb, Co, and Ni containing 40 mass% to 90 mass% of indium, 10 mass% to 60 mass% of silver and 0.01 mass% to 5 mass% of at least one metal selected from a group consisting of Se, Sb, Co, and Ni and further comprising a layer of oxide of the alloy on the alloy layer in that order on an iron-containing substrate in which copper diffuses in the alloy layer.