METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC COMPONENT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component device capable of performing overmold and underfill using a sheet-like thermosetting resin composition without being restricted by an electronic component size and a gap width between an electronic component and a mounting substrate.SOLUTION: A method for manufacturing an electronic component device includes the steps of: preparing a mounting substrate to which an electronic component was face-down connected; obtaining a laminate by arranging a sheet-like thermosetting resin composition on the electronic component; pressing the laminate in a chamber being in a pressure-reduced state; and pressurizing the pressed laminate in a chamber being in a high-pressure state.