发明名称 PUSH SWITCH
摘要 Provided is a pushbutton switch that can be made thin without requiring that a notch be made into a mounting board. The pushbutton switch is provided with a first substrate having a housing recess part located on a surface of the first substrate, a center contact provided at roughly the center of the interior of the housing recess part, a pair of peripheral contacts provided on peripheral edge parts of the housing recess part, a movable contact spring that is installed on the pair of peripheral contacts and that touches the center contact upon being pressed, and a second substrate, which is provided with a pair of connection pads electrically connected to the first substrate. A cross section of the first and second substrates is formed as a whole into an
申请公布号 US2014151213(A1) 申请公布日期 2014.06.05
申请号 US201314128591 申请日期 2013.02.22
申请人 CITIZEN HOLDINGS CO., LTD. ;CITIZEN ELECTRONICS CO., LTD. 发明人 Watanabe Shinsuke
分类号 H01H13/10 主分类号 H01H13/10
代理机构 代理人
主权项 1. A push switch comprising: a first substrate having an accommodating recess on a front surface thereof; a center contact provided so as to be substantially centralized in said accommodating recess; a pair of peripheral contacts each provided at a circumferential edge of said accommodating recess; a movable contact spring constructed so as to extend across said pair of peripheral contacts and designed to be brought into contact with said center contact when pressed; and a second substrate having a pair of connection pads electrically connected to said first substrate, wherein said first substrate and said second substrate are formed as an integral structure so as to provide an L-shaped cross section, said first substrate has a pair of electrically conductive back surface patterns on a back surface thereof, said center contact is electrically connected to one of said pair of back surface patterns, said pair of peripheral contacts is connected to the other one of said pair of back surface patterns, said second substrate has a pair of electrically conductive connection patterns on a side face thereof for connecting to said pair of back surface patterns formed on a said first substrate, and a pair of connection pads each electrically connected to a corresponding one of said pair of electrically conductive connection patterns, and said first substrate and said second substrate are bonded together by bonding said back surface of said first substrate to said side face of said second substrate to form said integral structure having said L-shaped cross section, and said integral structure is mounted on a side edge of a mounting substrate.
地址 Tokyo JP