| 摘要 |
To provide a hard gold-based plating solution which enables selective partial plating treatment and is suitable for electronic components such as a connector. A hard gold-based plating solution of the present invention comprises: a soluble gold salt or a gold complex; a conductive salt; and a chelating agent, wherein the hard gold-based plating solution further comprises an aromatic compound having one or more nitro groups, for example, an aromatic compound selected from the group consisting of nitrobenzoic acid, dinitrobenzoic acid and nitrobenzene sulfonic acid. The hard gold-based plating solution further comprises at least one metal salt of a cobalt salt, a nickel salt and a silver salt, or polyethyleneimine as an organic additive. |
