| 摘要 |
The invention relates to a photonic sensor, comprising a platform 2 supported by at least one slender element 10, 12 over a substrate 8, a temperature sensor (thermocouple, a thermopile, a bolometer or any other suitable sensing technology) on the platform, and a sub-wavelength structure 20 formed on or as part of the platform. Said sub-wavelength structure 20 comprises either a plurality of isolated or interconnected upstanding regions. It is thus possible to provide a sensor, such as an infrared sensor, where suitable profiling of the platform can reduce the mass, and hence the heat capacity of the platform. |
