| 摘要 |
A method of forming an encapsulated solid electrochemical component includes stacking a first separator (3), a solid electrochemical component (4), and a second separator (5) on an upper surface of a vacuum plate to form an electrochemical component assembly, applying a vacuum to the electrochemical component assembly, and applying a first laser beam around at least part of a circumference (21) of the solid electrochemical component (4) in the electrochemical component assembly while applying the vacuum to melt and bond the first and second separators (3,5) together. The method also includes applying a second laser beam around the circumference (21) of the solid electrochemical component (4) in the electrochemical component assembly while applying the vacuum. The second laser beam has a second relatively high power compared to the power of the first laser beam such that the first and second separators (3,5) around the circumference (21) of the solid electrochemical component (4) are cut. |
