发明名称 |
Adhesive film and method of encapsulating organic electrode device using the same |
摘要 |
An adhesive film, and a product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable hot-melt adhesive layer including a curable resin and a moisture absorbent, and the curable hot-melt adhesive layer includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive layer. |
申请公布号 |
US8742411(B2) |
申请公布日期 |
2014.06.03 |
申请号 |
US201313886098 |
申请日期 |
2013.05.02 |
申请人 |
LG Chem, Ltd. |
发明人 |
Yoo Hyun Jee;Cho Yoon Gyung;Shim Jung Sup;Lee Suk Chin;Jeong Kwang Jin;Chang Suk Ky |
分类号 |
H01L29/08;H01L35/24;H01L51/00;H01L33/00 |
主分类号 |
H01L29/08 |
代理机构 |
|
代理人 |
|
主权项 |
1. An adhesive film for encapsulating an organic electronic device (OED), comprising:
a curable hot-melt adhesive layer including a curable resin and a moisture absorbent, wherein the curable hot-melt adhesive layer comprises a first region coming in contact with the OED upon encapsulation of the OED; and a second region not coming in contact with the OED, and the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive layer.
|
地址 |
Seoul KR |