发明名称 Metallic surface enhancement
摘要 A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; an organic compound comprising a nitrogen-containing functional group; and a solvent having a surface tension less than about 50 dynes/cm as measured at 25° C.
申请公布号 US8741390(B2) 申请公布日期 2014.06.03
申请号 US20080596559 申请日期 2008.04.18
申请人 Enthone Inc. 发明人 Abys Joseph A.;Sun Shenliang;Fan Chonglun;Kudrak, Jr. Edward J.;Wang Cai
分类号 C23F11/167;C23F11/14;C23F11/16 主分类号 C23F11/167
代理机构 代理人
主权项 1. A method for enhancing the corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and having a metal layer comprising a base metal on a surface of the substrate, the method comprising: exposing the device to the composition comprising: a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, and mixtures thereof;an organic compound comprising a nitrogen-containing functional group selected from the group consisting of amine, aromatic heterocycle comprising nitrogen, and a combination thereof; anda solvent having a surface tension less than about 50 dynes/cm as measured at 25° C. wherein the solvent comprises water and a surfactant.
地址 West Haven CT US