Cast grid array (CGA) package and socket

摘要

A cast grid array (CGA) package comprises shaped solder posts which may be reflowed and connected directly to a circuit board, such as mother board, or remain in a solid state with the shape allowing them to be secured within a CGA socket which, in turn, may be connected to the a board. Embodiments of the CGA allows for a lower cost socket and package combination by using solder post to interface the socket and not requiring a loading mechanism on every socket.

主权项

1. A system for packaging an integrated circuit (IC) chip, comprising:
a package configured to house an integrated circuit on a top side; a plurality of cast solder posts on a bottom side of the package, wherein each of the cast solder posts has a cylindrical base transitioning to a tapered conical tip; and a socket connected to a board wherein the socket comprises a plurality of contacts configured to mate with the plurality of cast solder posts without a need for the cast solder posts to be reflowed to a liquid state and then solidified for connection to the contacts, wherein the cast solder posts are sized and shaped to have the ability to be inserted into and thereby securely connected to the socket that is connected to the board without a need for the cast solder posts to be reflowed to a liquid state and then solidified for connection to the socket, and wherein the cast solder posts are sized and shaped to have the ability to be reflowed to a liquid state and then solidified for direct connection to the board.