发明名称 Heat treatment method and heat treatment apparatus
摘要 A substrate holder has two holder constituting bodies, each having a plurality of columns arranged on an imaginary circle, and substrate holding sections that hold circumferential portions of respective substrates. The holder constituting bodies hold the substrates so that either their front surfaces or their back surfaces face upward with a substrate having an upward facing front and a substrate having an upward facing rear being alternately arranged in a vertical direction. At least one of the holder constituting bodies moves in the vertical direction to change the positions of the holder constituting bodies relative to each other. A distance between a first pair of vertically adjacent substrates with their respective front surfaces facing each other is set to ensure treatment uniformity, and to be larger than a distance between a second pair of vertically adjacent substrates with their respective back surfaces facing each other.
申请公布号 US8741064(B2) 申请公布日期 2014.06.03
申请号 US201213533206 申请日期 2012.06.26
申请人 Tokyo Electron Limited 发明人 Inoue Hisashi;Matsumoto Shunichi;Takeuchi Yasushi
分类号 C23C16/00 主分类号 C23C16/00
代理机构 代理人
主权项 1. A heat treatment method in which a plurality of substrates to be treated is held by a substrate holder at predetermined vertical intervals, the substrate holder is carried into a heat treating furnace, and a predetermined heat treatment is performed on the substrates, the method comprising the steps of: forming a multi-plate unit to hold circumferential portions of two substrates under the condition that back surfaces of the two substrates face each other; holding a plurality of the multi-plate units by means of the substrate holder at a vertical interval larger than a distance between the front surface of one of the two substrates held by the multi-plate unit and the back surface of the other of the two substrates such that a first distance between one of a first pair of substrates that are vertically adjacent each other and have respective front surfaces facing each other and the other of the first pair of substrates is larger than a second distance between one of a second pair of substrates that are vertically adjacent each other and have respective back surfaces facing each other and the other of the second pair of substrates; and performing the predetermined heat treatment, wherein each of the multi-plate units has a first support ring and a second support ring, each of the first support rings being adapted to hold the substrate under the condition that the back surface of the substrate faces upward, each of the second support rings being adapted to hold the substrate under the condition that the front surface of the substrate faces upward.
地址 Tokyo JP