发明名称 |
Methods of forming pillars for memory cells using sequential sidewall patterning |
摘要 |
The present invention provides apparatus, methods, and systems for fabricating memory structures methods of forming pillars for memory cells using sequential sidewall patterning. The invention includes forming first features from a first template layer disposed above a memory layer stack; forming first sidewall spacers adjacent the first features; forming second features that extend in a first direction in a mask layer by using the first sidewall spacers as a hardmask; depositing a second template layer on the mask layer; forming third features from the second template layer; forming second sidewall spacers adjacent the third features; and forming fourth features that extend in a second direction in the mask layer by using the second sidewall spacers as a hardmask. Numerous additional aspects are disclosed. |
申请公布号 |
US8741696(B2) |
申请公布日期 |
2014.06.03 |
申请号 |
US20100911944 |
申请日期 |
2010.10.26 |
申请人 |
SanDisk 3D LLC |
发明人 |
Scheuerlein Roy E.;Petti Christopher J.;Tanaka Yoichiro |
分类号 |
H01L21/82 |
主分类号 |
H01L21/82 |
代理机构 |
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代理人 |
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主权项 |
1. A method of forming a mask for patterning a memory array, comprising:
forming first line features from a first template layer disposed above a memory layer stack; forming first sidewall spacers adjacent the first line features; forming second line features that extend in a first direction in a mask layer by using the first sidewall spacers as a hardmask; depositing a second template layer on the mask layer; forming third line features from the second template layer that extend in a second direction perpendicular to the first direction; forming second sidewall spacers adjacent the third line features; and forming an array of pillar features in the mask layer by using the second sidewall spacers as a hardmask.
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地址 |
Milpitas CA US |