发明名称 |
SOLDER MASK WITH ANCHOR STRUCTURES |
摘要 |
<p>Various substrates or circuit boards for receiving a semiconductor chip and methods of processing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first opening in a solder mask positioned on a side of a substrate. The first opening does not extend to the side. A second opening is formed in the solder mask that extends to the side. The first opening may serve as an underfill anchor site.</p> |
申请公布号 |
KR20140066706(A) |
申请公布日期 |
2014.06.02 |
申请号 |
KR20147004095 |
申请日期 |
2012.08.27 |
申请人 |
ATI TECHNOLOGIES ULC;ADVANCED MICRO DEVICES, INC. |
发明人 |
KW LEUNG ANDREW;TOPACIO RODEN R.;HSIEH YU LING;LOW YIP SENG |
分类号 |
H01L23/498;H01L21/56 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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