金属柱焊接晶片连接之封装构造及其电路基板,申请号TW098139833-传众专利搜索

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发明名称	金属柱焊接晶片连接之封装构造及其电路基板
摘要
申请公布号	TWI440145	申请公布日期	2014.06.01
申请号	TW098139833	申请日期	2009.11.23
申请人	力成科技股份有限公司新竹县湖口乡新竹工业区大同路26号	发明人	叶昀鑫
分类号	H01L23/28;H01L23/492;H01L23/52	主分类号	H01L23/28
代理机构		代理人	许庆祥高雄市前镇区复兴四路12号3楼之7
主权项
地址	新竹县湖口乡新竹工业区大同路26号

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