MANUFACTURING METHOD FOR LIGHT EMITTING DIODE

摘要

Disclosed is a manufacturing method for an light emitting diode (LED), which comprises the following steps: 1) mounting an LED chip on a substrate (S01); 2) mounting a screen printing template on the LED chip (S02); 3) coating a layer of silica gel on the surface of the screen printing template (S03); 4) printing fluorescent powder: printing the fluorescent powder on the surface of the LED chip by adopting a screen printing technology and recovering the surplus fluorescent powder (S04); and 5) removing the screen printing template, baking and curing the fluorescent powder, and coating the cured fluorescent powder on the surface of the LED chip (S05). By using a packaging method, after the screen printing, the unused fluorescent powder glue mixture is not polluted by a screen printing template material and can be recycled and reused.