| 摘要 |
A wafer level package comprises at least two self-supporting elements (1, 5) connected to each other for forming a hollow inside space (8.1,..., 8.7). An opening (3.1,..., 3.7) connects the hollow inside space to an outside surface of the at least two elements (1, 5). A getter material (4.1,..., 4.7) is provided at an outside main surface (1.1) of the two self- supporting elements (1, 5). The getter material (4.1,..., 4.7) may be provided at the outer main face of the cap element and may form a layer covering the predominant part of the said outer surface. The wafer level package may be used for housing a mobile structure (7.1,.... 7.7) of a MEMS device. The wafer level package is placed in a sealed housing with a housing space. |
