发明名称 SUBSTRATE PROCESSING DEVICE, COVER OPENING AND CLOSING MECHANISM, SHIELDING MECHANISM, AND METHOD FOR PURGING INSIDE OF CONTAINER
摘要 <p>Provided is a substrate processing device that can suppress the amount of inert gas and dry gas used and also can prevent reductions in throughput. A substrate processing device (10) is provided with: a loader module (13); an opener (42) that removes a cover (32) from a FOUP (30) having a main body (31), an opening part (33), and a cover (32) and forms a link between the inside of the FOUP (30) and the inside of the loader module (13) via the opening part (33); an N2 gas supply unit (47) that is attached to the loader module (13) and supplies N2 gas to the inside of the FOUP (30); and two plate-shaped slide covers (43, 44) that move freely of each other along an opening surface of the opening part (33). The slide covers (43, 44) shield the opening part (33) of the FOUP (30) that is attached to the loader module (13) from the inside of the loader module (13) by approaching each other until the gap therebetween is 1 - 3 mm.</p>
申请公布号 WO2014080851(A1) 申请公布日期 2014.05.30
申请号 WO2013JP80969 申请日期 2013.11.12
申请人 TOKYO ELECTRON LIMITED 发明人 WAKABAYASHI, SHINJI
分类号 H01L21/677 主分类号 H01L21/677
代理机构 代理人
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