| 摘要 |
A high-density storage appliance comprises a printed circuit board (PCB) to which a plurality of solid state drives (SSDs) are coupled. Each of the SSDs has a connector positioned along a width of the SSD, which is shorter than a height of the SSD. Further, each SSD is coupled to the PCB such that an aspect ratio of a height of the SSD above the PCB to a width of the SSD in parallel to the PCB is greater than 1.0. The SSDs may be arranged in a plurality of rows and a plurality of columns to simplify installation and removal of the SSDs and to facilitate airflow about the SSDs for cooling. |
