发明名称 |
ENCAPSULANT FOR A SEMICONDUCTOR DEVICE |
摘要 |
A mold compound is provided for encapsulating a semiconductor device (101). The mold compound comprises at least approximately 70% by weight silica fillers, at least approximately 10% by weight epoxy resin system, and beneficial ions that are beneficial with respect to copper ball bond corrosion. A total level of the beneficial ions in the mold compound is at least approximately 100 ppm. |
申请公布号 |
US2014145339(A1) |
申请公布日期 |
2014.05.29 |
申请号 |
US201414170067 |
申请日期 |
2014.01.31 |
申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
CHOPIN SHEILA F.;MATHEW VARUGHESE;HIGGINS, III LEO M.;LEE CHU-CHUNG |
分类号 |
H01L23/29;H01L23/28;H01L23/48 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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