发明名称 |
APPARATUS FOR FRACTURING POLYCRYSTALLINE SILICON |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide an apparatus for fracturing polycrystalline silicon capable of fracturing the polycrystalline silicon while suppressing a loss ratio at an optimal fracturing rate without adjusting a clearance between fracture rolls in one fracturing apparatus.SOLUTION: In an apparatus for fracturing polycrystalline silicon where massive polycrystalline silicon is sandwiched between a pair of fracture rolls 2 reversely rotating each other and fractured,: a plurality of fracture teeth 10 are set to be projected outside in a radial direction on the outer peripheral surface of the fracture rolls 2 and set so that distances between circumscribed circles passing the tips of a plurality of the fracture teeth 10 of the fracture rolls 2 are wider at tip 5 sides than at base end 4 sides; a pair of feed rollers 3 to transfer the polycrystalline silicon placed at an upper position of the opposite part of the fracture rolls 2 from the base end 20 sides to the tip 21 sides are set; and the feed rollers 3 are positioned so that the mutual distance between the feed rollers 3 in a horizontal direction is wider at the tip 21 sides than at the base end 20 sides.</p> |
申请公布号 |
JP2014097489(A) |
申请公布日期 |
2014.05.29 |
申请号 |
JP20130216518 |
申请日期 |
2013.10.17 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
KIMURA TOSHIRO;SATO MOTOKI |
分类号 |
B02C4/08;B02C4/28;B02C4/30 |
主分类号 |
B02C4/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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