发明名称 METHOD OF ANALYZING ALDEHYDE COMPOUND IN METAL PLATING SOLUTION
摘要 This invention relates to a method of analyzing an aldehyde compound in a metal plating solution, including adding a pH control solution to an aldehyde derivative, thus preparing an oversaturated aldehyde derivative solution in which the aldehyde derivative is dissolved to be oversaturated while the pH of the aldehyde derivative solution is adjusted to be the same as that of the metal plating solution; adding the oversaturated aldehyde derivative solution to the metal plating solution, so that the aldehyde compound which is present in the metal plating solution undergoes derivation, thus obtaining an aldehyde derivative compound; extracting the aldehyde derivative compound; and analyzing the aldehyde compound from the extracted aldehyde derivative compound.
申请公布号 US2014147926(A1) 申请公布日期 2014.05.29
申请号 US201313829617 申请日期 2013.03.14
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 JEON JI EUN;LEE SE KYUNG;YOON HYO JIN;HAM SUK JIN
分类号 G01N33/20 主分类号 G01N33/20
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