| 摘要 |
Packaged light detector semiconductor devices (PLDSDs), methods for manufacturing PLDSDs, and systems including a PLDSD are described herein. In an embodiment, a PLDSD includes a light detector die having a surface including an active photosensor region, and a non-imaging optical concentrator including an entrance aperture and an exit aperture axially aligned with one another and with the active photosensor region. A molding material forms the non-imaging optical concentrator and encapsulates at least a portion of the surface of the light detector die that extends beyond the exit aperture of the non-imaging optical concentrator. The non-imaging optical concentrator concentrates light from the entrance aperture toward the exit aperture and onto the active photosensor region. In certain embodiments, a reflective material is disposed on an inner surface of the non-imaging optical concentrator, and a light transmissive molding material fills at least a portion of an inner volume of the non-imaging optical concentrator. |
