| 摘要 |
PROBLEM TO BE SOLVED: To accurately determine the quality of a joint between an electronic component and a substrate.SOLUTION: An X-ray inspection apparatus for inspecting a joint between an electronic component and a substrate, includes: radiographing means for acquiring three-dimensional data on the inside of the joint using X-rays; cross-sectional image acquisition means for acquiring one or plural cross-sectional images from the three-dimensional data on the joint; void measurement means for measuring the area of a void in each cross-sectional image; and determination means for determining the quality of the joint on the basis of the area of the void in the cross-sectional image. In the quality determination, it can be determined that the joint is faulty when the total area of voids or the area of the largest void in the cross-sectional image exceeds a predetermined threshold. |
