发明名称 |
METHOD OF ENCAPSULATING A MICRO-ELECTROMECHANICAL (MEMS) DEVICE |
摘要 |
A method for encapsulating a micro-electromechanical (MEMS) device, the method comprising: providing a sacrificial layer arrangement over the MEMS device; providing a first encapsulation layer over the sacrificial layer arrangement, the first encapsulation layer defining at least one aperture; providing a second encapsulation layer over the at least one aperture, the second encapsulation layer being provided to allow removal of the sacrificial layer arrangement around the second encapsulation layer; and removing the sacrificial layer arrangement through the at least one aperture to allow the second encapsulation layer to cover the at least one aperture thereby encapsulating the MEMS device. |
申请公布号 |
US2014147955(A1) |
申请公布日期 |
2014.05.29 |
申请号 |
US201314093348 |
申请日期 |
2013.11.29 |
申请人 |
LEE JAE-WUNG;SHARMA JAIBIR;SINGH NAVAB;TSAI JULIUS MING LING;AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH |
发明人 |
LEE JAE-WUNG;SHARMA JAIBIR;SINGH NAVAB;TSAI JULIUS MING LING |
分类号 |
B81C1/00 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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