发明名称 METHODS OF FORMING WIRING TO TRANSISTOR AND RELATED TRANSISTOR
摘要 Methods of wiring to a transistor and a related transistor are disclosed. In one embodiment, the method includes a method of forming wiring to a transistor, the method comprising: forming a transistor on a semiconductor-on-insulator (SOI) substrate using masks that are mirror images of an intended layout, the forming including forming a gate and a source/drain region for each and a channel, the SOI substrate including a semiconductor-on-insulator (SOI) layer, a buried insulator layer and a silicon substrate; forming a dielectric layer over the transistor; bonding the dielectric layer to another substrate; removing the silicon substrate from the SOI substrate to the buried insulator layer; forming a contact to each of the source/drain region and the gate from a channel side of the gate; and forming at least one wiring to the contacts on the channel side of the gate.
申请公布号 US2014145264(A1) 申请公布日期 2014.05.29
申请号 US201414167298 申请日期 2014.01.29
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 FRANK DAVID J.;LATULIPE, JR. DOUGLAS C.;STEEN STEVEN E.;TOPOL ANNA W.
分类号 H01L29/66;H01L29/78 主分类号 H01L29/66
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