| 摘要 |
<p>An object of the present invention is to provide a composition for the formation of a cured epoxy resin, wherein the composition can suppress a curing reaction at a low temperature to thereby enhance one-pack stability, and can also be subjected to a heating treatment to thereby effectively cure a resin. The present invention provides a composition for the formation of a cured epoxy resin, the composition comprising the following components (A), (B) and (C):
(A) an epoxy resin;
(B) a clathrate compound of a carboxylic acid derivative represented by formula (I):
€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒR(COOH)n€ƒ€ƒ€ƒ€ƒ€ƒ(I);
and an imidazole compound represented by formula (II); and (C) a tetrakisphenol type compound represented by formula (III).</p> |
