发明名称 |
Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a terminal having a top with a depression; applying a dielectric material in the depression, the dielectric material having a gap formed therein and exposing a portion of the top therefrom; forming a trace within the gap and in direct contact with the top, the trace extending laterally over an upper surface of the dielectric material; and connecting an integrated circuit to the terminal through the trace. |
申请公布号 |
US8735224(B2) |
申请公布日期 |
2014.05.27 |
申请号 |
US201113102044 |
申请日期 |
2011.05.05 |
申请人 |
DO BYUNG TAI;TRASPORTO ARNEL SENOSA;CAMACHO ZIGMUND RAMIREZ;STATS CHIPPAC LTD. |
发明人 |
DO BYUNG TAI;TRASPORTO ARNEL SENOSA;CAMACHO ZIGMUND RAMIREZ |
分类号 |
H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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