发明名称 |
Resin composition, prepreg laminate obtained with the same and printed-wiring board |
摘要 |
Disclosed are a resin composition containing (a) a maleimide compound having at least two N-substituted maleimide groups in a molecular structure and (b) a silicone compound having at least one reactive organic group in a molecular structure thereof; and a prepreg using the same, a laminate, and a printed wiring board. A resin composition having excellent heat resistance and low thermal expansion properties; and a prepreg, a laminate, and a printed wiring board using the same can be provided. |
申请公布号 |
US8735733(B2) |
申请公布日期 |
2014.05.27 |
申请号 |
US201213352819 |
申请日期 |
2012.01.18 |
申请人 |
MIYATAKE MASATO;KOTAKE TOMOHIKO;NAGAI SHUNSUKE;HASHIMOTO SHINTARO;INOUE YASUO;TAKANEZAWA SHIN;MURAI HIKARI;HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
MIYATAKE MASATO;KOTAKE TOMOHIKO;NAGAI SHUNSUKE;HASHIMOTO SHINTARO;INOUE YASUO;TAKANEZAWA SHIN;MURAI HIKARI |
分类号 |
E04B1/78;B32B27/04;B32B27/34;H05K1/00 |
主分类号 |
E04B1/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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