ESD DEVICES COMPRISING SEMICONDUCTOR FINS

摘要

A device includes a semiconductor substrate, and an insulating region which is extended from the uppermost surface of the semiconductor substrate to the inner part of the semiconductor substrate. The device further includes a first node, a second node, and an electrostatic discharge (ESD) device which is connected between the first node and the second node. The ESD device is adjacent to the upper part of the uppermost surface of the insulating region and includes a semiconductor fin. The ESD device responds to ESD transient on the first node to transmit a current from the first node to the second node.