| 摘要 |
The present invention relates to a carrier head cleaning apparatus used a chemical mechanical polishing process. A carrier head cleaning apparatus used in a chemical mechanical polishing process includes a first bath which receives liquid; a vibration plate which is dipped in the liquid of the first bath and is vibrated by a vibrator; a second bath which is arranged in a position where the liquid of the first bath is partly dipped, receives a cleaning solution of cleaning the carrier head, and comprises a first discharge hole which is formed in a sidewall adjacent to a bottom surface, a second discharge part which is located in a position which is higher than the first discharge hole, and a transparent bottom surface; A first discharge path which is extended from the first discharge hole to the outside to discharge contaminated water which is discharged from the second bath to the outside through the first discharge hole to the outside without passing through the liquid of the first bath; A second discharge path which is extended from the second discharge hole to the outside to discharge contaminated water which is discharged from the second bath to the outside through the second discharge hole to the outside without passing through the liquid of the first bath. The state of the cleaning solution of the second bath which cleans a carrier head is kept cleaner. A foreign material generated in the cleaning process of the carrier head is immediately discharged from the second bath. Thereby, the cleaning apparatus of the carrier head which improves the cleaning efficiency of the carrier head is provided. |
