发明名称 Semiconductor device manufacturing method and computer-readable storage medium
摘要 There is provided a semiconductor device manufacturing method for forming a step-shaped structure in a substrate by etching the substrate having thereon a multilayer film and a photoresist film on the multilayer film and serving as an etching mask. The multilayer film is formed by alternately layering a first film having a first permittivity and a second film having a second permittivity different from the first permittivity. The method includes a first process for plasma-etching the first film by using the photoresist film as a mask; a second process for exposing the photoresist film to hydrogen-containing plasma; a third process for trimming the photoresist film; and a fourth process for etching the second film by using the trimmed photoresist film and the plasma-etched first film as a mask. The step-shaped structure is formed in the multilayer film by repeatedly performing the first process to the fourth process in this sequence.
申请公布号 US8735299(B2) 申请公布日期 2014.05.27
申请号 US201213410512 申请日期 2012.03.02
申请人 WATANABE SEIICHI;SATO MANABU;NARISHIGE KAZUKI;SATO TAKANORI;KATSUNUMA TAKAYUKI;TOKYO ELECTRON LIMITED 发明人 WATANABE SEIICHI;SATO MANABU;NARISHIGE KAZUKI;SATO TAKANORI;KATSUNUMA TAKAYUKI
分类号 H01L21/302 主分类号 H01L21/302
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