发明名称 Bonding inspection structure
摘要 A bonding inspection structure is provided. The bonding inspection structure includes at least a elastic bump located on a substrate. At least an opening is formed in the top portion of the elastic bump. An inspection area of the top portion of the elastic bump is larger than an area of the opening.
申请公布号 US8736083(B2) 申请公布日期 2014.05.27
申请号 US20090431766 申请日期 2009.04.29
申请人 YANG SHENG-SHU;LEE HSIAO-TING;AN CHAO-CHYUN;TAIWAN TFT LCD ASSOCIATION;CHUNGHWA PICTURE TUBES, LTD.;AU OPTRONICS CORPORATION;HANNSTAR DISPLAY CORPORATION;CHIMEI INNOLUX CORPORATION;INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 YANG SHENG-SHU;LEE HSIAO-TING;AN CHAO-CHYUN
分类号 H01L23/544 主分类号 H01L23/544
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