| 摘要 |
The purpose of the present invention is to provide a phorocurable resin composition capable of conveniently performing fine pattern formation, especially a contact hole pattern, exhibiting various film properties and excellent adhesion on basic materials when the film is post-cured at low temperatures, exhibiting reliability as an electric/electronic part, especially drug resistance on a solder flux liquid, and providing a film with high reliability; a patterning method; and a protective film for an electric/electronic part. To resolve problems, the present invention provides the photocurable resin composition comprises; polymers of a weight-average molecular weight of 3,000-500,000 which comprises epoxy groups and repeating units represented by a formula (1); onium salt-based photoacid generators which comprises tetrakis-(pentafluorophenyl)borate anions represented by a formula (4); solvents; and a cross-linking agent which comprises epoxy resins as necessary. [Reference numerals] (AA) Basalt cobble stone or light weight aggregate;(BB) Fill in a mold;(CC) Mortar injection and vibration;(DD) Drying and curing;(EE) Making into a construction material |
