| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide means for thinning the thickness of a semiconductor device in which a plurality of semiconductor chips are mounted.SOLUTION: A pad electrode 14 of a semiconductor chip 10 is connected to one surface of a re-wiring layer 30, and a bump electrode 29 of a semiconductor chip 20 is connected to the other surface of the re-wiring layer 30. The flip-chip mounting of the two semiconductor chips 10 and 20 to the same re-wiring layer without using a rigid wiring substrate can thin the entire thickness as compared to conventional semiconductor devices, thereby satisfying the demand of low profile.</p> |
