发明名称 MULTI-CHIP SYSTEM AND SEMICONDUCTOR PACKAGE
摘要 A multi-chip system may include a plurality of chips, and a channel shared by the plurality of chips. At least one of the plurality of chips includes a transmission circuit configured to transmit a signal to the channel. Drivability of the transmission circuit is adjusted based on a number of the plurality of chips.
申请公布号 US2014139269(A1) 申请公布日期 2014.05.22
申请号 US201313841114 申请日期 2013.03.15
申请人 SK HYNIX INC. 发明人 JEONG CHUN-SEOK
分类号 H03K3/36 主分类号 H03K3/36
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