摘要 |
The present invention relates to a semiconductor treating device with bearing means for mounting a plate having a plate plane, said plate having a) a functional zone (4) which is flat, b) a bearing zone (5) surrounding the functional zone (4) at least in sections, and c) and an application zone (6) which is arranged outside the functional zone (4) and outside the bearing zone (5), the bearing means (2, 2', ", 2"', 2IV) being designed to mount the plate (1) in the bearing zone (5). The application means can be controlled such that the flatness can be adjusted and/or changed and/or influenced by deforming the functional zone (4). The invention is characterized in that the application means comprise at least one vacuum zone (7) that allows deformation of the plate (1) in the bearing zone (5). The invention further relates to a corresponding method. |