发明名称 COMPOSITE WIRING BOARD AND PROCESS OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a composite wiring board having high productivity.SOLUTION: Since a caulked part 36 is simultaneously formed at an opening 30 for accommodation, a printed wiring board can be accurately positioned in reference to a metal frame 30G. Furthermore, compared to a fixing method using an adhesive, since filling and curing of the adhesive becomes unnecessary and processing steps decrease, productivity is increased and a printed wiring board can be fixed to a metal frame at low cost.
申请公布号 JP2014096468(A) 申请公布日期 2014.05.22
申请号 JP20120247048 申请日期 2012.11.09
申请人 IBIDEN CO LTD 发明人 ISHIHARA TERUYUKI;TAKAHASHI MICHIMASA
分类号 H05K3/34;B23K1/00;B23K1/008;B23K101/42;H05K3/00;H05K3/46 主分类号 H05K3/34
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