| 摘要 |
Provided is a method for manufacturing a printed circuit board, and a surface treatment device for use in said method, that not only can suppress hole diameter fluctuation caused by transporting scratches incurred during horizontal transport but also can reduce laser machining energy. This method for manufacturing a printed circuit board comprises a pretreatment step in which a copper layer (3) that is a surface layer of a laminate for printed circuit board manufacturing (10), and a laser machining step in which holes are formed in the surface of the copper layer (3) after the pretreatment step by irradiation with laser light. The pretreatment step comprises a first surface treatment step in which the surface of the copper layer (3) is brought into contact with an aqueous solution (A) in an oxygen-containing atmosphere, and a second surface treatment step in which the surface of the copper layer (3) after the first surface treatment step is brought into contact with an aqueous solution (B). In the present invention, in the second surface treatment step, the surface of the copper layer (3) is brought into contact with the aqueous solution (B) without oxygen being supplied. |
