发明名称 INSPECTION DEVICE AND INSPECTION METHOD OF INFRARED SOLID-STATE IMAGING ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide an inspection device and an inspection method of an infrared solid-state imaging element, which can improve manufacturing throughput and can prevent a rise of manufacturing cost.SOLUTION: An infrared solid-state imaging element includes at least one infrared detection pixel which generates an electric signal corresponding to an incident infrared ray and the size of supplied constant current. An inspection device includes: a current control section for controlling the size of the constant current and supplies first and second contant currents different in sizes; a constant current supply time control section for controlling time when the first and second constant currents are supplied; an AD converter for converting first and second electric signals at the time when the first and second constant currents are supplied into first and second digital signals; a subtraction section for calculating a difference between the first digital signal and the second digital signal; and a determining section for determining whether the infrared detection pixel is defective or not according to an absolute value of the difference calculated by the subtraction section.
申请公布号 JP2014096773(A) 申请公布日期 2014.05.22
申请号 JP20120248682 申请日期 2012.11.12
申请人 TOSHIBA CORP 发明人 HONDA HIRONAGA;ISHII KOICHI;FUNAKI HIDEYUKI;SASAKI KEITA
分类号 H04N5/33;H01L27/14;H01L27/144;H04N5/367 主分类号 H04N5/33
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